| Manufacture Capacity | ||||||
| 1:Material | ||||||
| Item | Material | |||||
| Base material | CEM1-3,(Normal/High Tg)Fr-4,rogers, PTFE Aluminum Base, etc | |||||
| Board thickness | 0.20mm~6.0mm | |||||
| Copper Foil thickness | 18um~350um | |||||
| 2:Parameter | ||||||
| Item | Volume | Sample or Prototype | ||||
| Layers | 1-16L | 1-22L | ||||
| Surface finished | EING,OSP,Lead free HASL,HAL,immersion silver/tin,etc | EING,OSP,Lead free HASL,HAL,immersion silver/tin,etc | ||||
| Solder Mask Type/Silkscreen Ink | LPI(green, white, black ,red ,etc) | LPI(green, white, black ,red ,etc) | ||||
| Maximum Panel Size | 550*620mm | 610mm*610mm | ||||
| Thickness | 0.2mm~3.2mm | 0.20mm~5.0mm | ||||
| Board Thickness Tolerance | ±8%(t≥1.0mm) and ±10%(t<1.0mm) | ±8%(t≥1.0mm) and ±10%(t<1.0mm) | ||||
| Finished Outer Copper Thickness | 35um-350um | 35um-350um | ||||
| Finished Inner Copper Thickness | 17um-190um | 17um-190um | ||||
| Minimum Trace Width/Space | 0.1mm | 0.1mm | ||||
| Minimum Insulation Layer Thickness | 0.1mm | 0.1mm | ||||
| Minimum Finished Hole Size(Mechanical) | 0.15mm | 0.15mm | ||||
| Minimum Trace Width/Space | 0.1mm | 0.1mm | ||||
| Hole Size Tolerance | PTH:+/-0.075mm NPTH:+/-0.05mm | PTH:+/-0.075mm NPTH:+/-0.05mm | ||||
| Minimum Board thickness for V-Groove process | 0.6mm(Min.) | 0.6mm(Min.) | ||||
| Minimum Board thickness for V-Groove process | 0.6mm*1.0mm | 0.60mm*0.90mm | ||||
| Aspect Ratio | ≤ 6:1 (below as 1.6mm） | ≤8：1 | ||||
